Raytron Technical Review RESEARCH ARTICLE WP-06-04

铜包锌材料特性与潜在Applications

Copper Clad Zinc: Material Properties and Potential Applications

RAYTRON Technical Team¹

¹RAYTRON Group, China

发布日期: March 2026 版本: 1.0

DOI: 10.1000/raytron.WP-06-04

摘要

铜包锌（CCZ）代表了一种新兴的Lightweight导体选择，具有独特的性能。本Whitepapers研究CCZ材料特性、制造考虑以及其性能提供优势的潜在Applications。

核心发现

Unique Density Positioning CCZ achieves density of 6.5-7.5 g/cm³, positioned between CCA (3.6 g/cm³) and pure copper (8.96 g/cm³), offering a medium-weight option for specific applications.
Battery System Compatibility Zinc core provides natural compatibility with zinc-based batteries (Zn-air, Zn-MnO₂, Zn-ion), making CCZ a potential current collector material for these emerging battery technologies.
Intermetallic Control Challenge Cu-Zn system forms brittle intermetallic phases (β-CuZn, γ-Cu₅Zn₈). Manufacturing must carefully control diffusion to prevent embrittlement while maintaining bond quality.
Cost-Performance Balance CCZ offers lower cost than copper with moderate conductivity (45-60% IACS), suitable for applications where moderate performance is acceptable and cost reduction is prioritized.

关键词

CCZ;copper clad zinc;lightweight conductor;emerging material

1. Introduction

1.1 CCZ Overview

Diagram placeholder

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Figure fig1 Figure 1: CCZ cross-sectional structure showing zinc core with copper cladding

Component	Material	Purpose
Core	Zinc (Zn)	Lightweight filler
Cladding	Copper	Conductivity surface

1.2 Motivation for CCZ

Factor	Cu	Al	Zn	CCZ Potential
Density (g/cm³)	8.96	2.70	7.14	~6-7
Conductivity (% IACS)	100	62	28	40-60
Cost ($/kg)	8-10	2-3	2-3	Low

1.3 Positioning

Material	Density	Conductivity	Cost	Application
Cu	High	Highest	High	Premium
CCA	Low	Good	Low	Standard
CCZ	Medium	Moderate	Low	Emerging

2. Material Properties

2.1 Physical Properties

Property	Zn	Cu	CCZ (est.)
Density (g/cm³)	7.14	8.96	6.5-7.5
Melting point (°C)	419	1085	-
Thermal expansion (ppm/K)	30	17	~20-25

2.2 Electrical Properties

Diagram placeholder

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Figure fig2 Figure 2: Conductivity comparison of CCZ configurations

Configuration	Conductivity	Notes
Pure Zn	28% IACS	Low
CCZ (30% Cu)	45-50% IACS	Estimated
CCZ (40% Cu)	55-60% IACS	Estimated

2.3 Mechanical Properties

Property	Zn	CCZ (est.)
Tensile strength (MPa)	100-150	150-250
Elongation (%)	20-40	5-15
Hardness (HV)	40-50	60-90

2.4 Corrosion Behavior

Environment	Zn Behavior	CCZ Consideration
Dry air	Stable	Cu surface protects
Humid air	White rust	Cu surface protects
Acidic	Dissolves	Cu protection needed

3. Manufacturing Considerations

3.1 Cladding Challenges

Challenge	Reason	Solution
Zn low melting point	419°C	Temperature control
Zn reactivity	With Cu, O2	Protective atmosphere
Brittle intermetallics	Cu-Zn phases	Control diffusion

3.2 Cu-Zn Phase Diagram

Diagram placeholder

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Figure fig3 Figure 3: Cu-Zn phase diagram showing intermetallic phases

Key intermetallic phases:

Phase	Composition	Concern
β-phase	CuZn	Brittle
γ-phase	Cu₅Zn₈	Very brittle
ε-phase	CuZn₅	Less concern

3.3 Manufacturing Approaches

Method	Suitability
Extrusion cladding	Possible
Electroplating	Established
Hot dipping	Possible

4. Potential Applications

4.1 Target Application Areas

Application	CCZ Advantage	Challenge
RF cables	Lower cost than Cu	Lower conductivity
Battery applications	Zn compatibility	Corrosion
Weight-sensitive	Lower density than Cu	Trade-offs
Cost-sensitive	Lower cost	Performance

4.2 RF Cable Cores

Factor	Cu	CCZ
RF loss	Baseline	Higher
Cost	High	Lower
Skin effect benefit	Good	Moderate

4.3 Battery Applications

0:00

VIDEO TODO

Video 1: CCZ potential in zinc-based battery systems

Zinc is used in batteries:

Battery Type	Zn Role	CCZ Potential
Zn-air	Anode	Current collector
Zn-MnO₂	Anode	Compatibility
Zn-ion	Anode	Conductor

4.4 Comparison with Alternatives

Application	Best Choice	Why
Standard RF	CCA	Cost-performance
High-performance RF	Cu or SCC	Performance
Battery-related	CCZ (potential)	Zn compatibility

5. Challenges and Opportunities

5.1 Technical Challenges

Diagram placeholder

MEDIA TODO

Figure fig4 Figure 4: Technical challenges roadmap for CCZ development

Challenge	Impact	Mitigation
Intermetallic formation	Embrittlement	Process control
Zn corrosion	Long-term reliability	Protection
Lower conductivity	Performance	Larger size

5.2 Market Opportunities

Opportunity	Potential
Cost reduction	vs Cu conductors
Battery market	Growing
Zinc availability	Abundant

5.3 Development Needs

Area	Requirement
Process optimization	Stable manufacturing
Property characterization	Complete data
Application testing	Validation
Standards development	Specification

6. Conclusion

6.1 Summary

Aspect	CCZ Status
Technology	Emerging
Properties	Moderate conductivity, low cost
Manufacturing	Challenges exist
Applications	Under development

6.2 Outlook

CCZ represents a potential cost-effective alternative for specific applications where:

Moderate conductivity acceptable
Cost reduction needed
Zinc compatibility beneficial

Further development needed for commercial viability.

7. References

ASM Handbook Volume 2. (2020). Nonferrous Alloys.
Copper Development Association. (2021). Copper-Zinc Alloys.

FAQ

What is the current development status of CCZ?

CCZ is in the laboratory to pilot stage. Technical feasibility has been demonstrated, but commercial production requires further process optimization, complete property characterization, application testing, and standards development.

How does CCZ conductivity compare to other conductors?

CCZ with 30% Cu cladding achieves approximately 45-50% IACS, with 40% Cu reaching 55-60% IACS. This is lower than CCA (62-68% IACS) but sufficient for applications where moderate conductivity is acceptable.

What are the main manufacturing challenges for CCZ?

Key challenges include: zinc's low melting point (419°C) limiting processing temperature; formation of brittle Cu-Zn intermetallics; zinc's reactivity requiring protective atmosphere; and need for precise process control to prevent defects.

Is CCZ suitable for RF cable applications?

CCZ has potential for RF cable cores where cost reduction is important and moderate RF performance is acceptable. However, for high-performance RF applications, CCA or copper remain better choices due to higher conductivity and better skin effect performance.

徐

徐高磊

(Gaolei Xu)

资深材料科学家

资质荣誉

• 锐创集团 CTO
• 浙江省高层次人才特殊支持计划青年人才
• 绍兴市"科技副总"
• 绍兴市科技特派员
• 全国有色金属standards化技术委员会重金属分技术委员会(TC243/SC2)委员

国家standards（主要起草人）查看官方

GB/T 27671-2011 - 导电用铜型材
YS/T 1043-2015 - 电机整流子用银无氧铜带材
YS/T 974-2014 - 复合触点材料用铜及铜合金带材
YS/T 1082-2015 - 灯引线支架用铜带

发明专利检索专利

CN104959396A - 一种复合触点材料用铜带的生产工艺
CN106077125A - 一种磁极线圈用铜型材的生产工艺
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CN201310376884 - 一种五位一体变压器用铜带边部处理设备
CN201420184755 - 一种连续挤压模具促流装置
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专业Section

CCA(CCA)技术铜包钢(CCS)制造工艺双金属复合材料光伏焊带技术电动汽车电池极耳材料连续挤压技术

代表性论文

• 轧制法制造金属层状复合材料的研究与Applications，《铝加工》2008年第3期
• 铜铝复合带退火工艺的研究
• 电缆用铜铝复合带制备工艺研究
• 轧制铜/铝复合带材在退火过程中的界面组织演变

徐高磊先生是有色金属加工Section的知名专家，拥有超过15年的丰富经验。他入选浙江省高层次人才特殊支持计划青年人才。他在双金属复合材料技术开发方面做出了重要贡献，并为中国铜及双金属材料的standards化工作做出了重要贡献。

点击standards/专利编号可查看官方文档

1. Introduction

1.1 CCZ Overview

1.2 Motivation for CCZ

1.3 Positioning

2. Material Properties

2.1 Physical Properties

2.2 Electrical Properties

2.3 Mechanical Properties

2.4 Corrosion Behavior

3. Manufacturing Considerations

3.1 Cladding Challenges

3.2 Cu-Zn Phase Diagram

3.3 Manufacturing Approaches

4. Potential Applications

4.1 Target Application Areas

4.2 RF Cable Cores

4.3 Battery Applications

4.4 Comparison with Alternatives

5. Challenges and Opportunities

5.1 Technical Challenges

5.2 Market Opportunities

5.3 Development Needs

6. Conclusion

6.1 Summary

6.2 Outlook

7. References

FAQ

What is the current development status of CCZ?

How does CCZ conductivity compare to other conductors?

What are the main manufacturing challenges for CCZ?

Is CCZ suitable for RF cable applications?

徐高磊

资质荣誉

国家standards（主要起草人） 查看官方

发明专利 检索专利

专业Section

代表性论文

马上联系锐创，让每米材料为您创造更高价值

在线联系

国家standards（主要起草人）查看官方

发明专利检索专利